发明名称 PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED
摘要 Provided is a novel pretreatment agent for electroless plating, not only having excellent adsorption of a catalyst used prior to electroless plating, but also having excellent anti-foaming properties whereby bubble formation is suppressed in a short time, and excellent permeability to a substrate. This pretreatment agent for electroless plating contains a silane coupling agent, a surfactant, an ethylene glycol butyl ether represented by the formula C4H9-(OC2H4)n-OH (n = an integer of 1-4), and/or a propylene glycol butyl ether represented by the formula C4H9-(OC3H6)n-OH (n = an integer of 1-4).
申请公布号 WO2016129373(A1) 申请公布日期 2016.08.18
申请号 WO2016JP52017 申请日期 2016.01.25
申请人 C. UYEMURA & CO., LTD. 发明人 SAIJO, Yoshikazu;YAMAMOTO, Hisamitsu;ISHIDA, Tetsuji;KOMEDA, Takuya;UTSUMI, Masayuki
分类号 C23C18/20;H05K3/18 主分类号 C23C18/20
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