发明名称 |
PRETREATMENT AGENT FOR ELECTROLESS PLATING, AND PRETREATMENT METHOD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD IN WHICH PRETREATMENT AGENT FOR ELECTROLESS PLATING IS USED |
摘要 |
Provided is a novel pretreatment agent for electroless plating, not only having excellent adsorption of a catalyst used prior to electroless plating, but also having excellent anti-foaming properties whereby bubble formation is suppressed in a short time, and excellent permeability to a substrate. This pretreatment agent for electroless plating contains a silane coupling agent, a surfactant, an ethylene glycol butyl ether represented by the formula C4H9-(OC2H4)n-OH (n = an integer of 1-4), and/or a propylene glycol butyl ether represented by the formula C4H9-(OC3H6)n-OH (n = an integer of 1-4). |
申请公布号 |
WO2016129373(A1) |
申请公布日期 |
2016.08.18 |
申请号 |
WO2016JP52017 |
申请日期 |
2016.01.25 |
申请人 |
C. UYEMURA & CO., LTD. |
发明人 |
SAIJO, Yoshikazu;YAMAMOTO, Hisamitsu;ISHIDA, Tetsuji;KOMEDA, Takuya;UTSUMI, Masayuki |
分类号 |
C23C18/20;H05K3/18 |
主分类号 |
C23C18/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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