| 摘要 |
<P>PROBLEM TO BE SOLVED: To hold a frame with suitable attracting force corresponding to the hardness of an adhesive tape even when an adhesive tape varying in hardness is used for a processing apparatus that holds a wafer held inside a ring-shaped frame through the adhesive tape in a holding means and processes the wafer. <P>SOLUTION: The holding means 30 includes a wafer holding portion 32 which holds the wafer 1 and a frame holding portion 33 which holds the frame 3. The frame holding means 33 includes a plurality of magnet mounting recessed portions 34 arrayed enclosing a wafer holding portion 31 and magnets 40 which are mounted detachably on the magnet mounting recessed portions 34 and attract the frame 3. The attracting force attracting the frame 3 is suitably adjusted in accordance with the hardness of the adhesive tape 2 by increasing or decreasing the number of magnets 40 mounted on magnet mounting recessed portions 34. <P>COPYRIGHT: (C)2009,JPO&INPIT |
