发明名称 PHOTOCURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photocurable resin composition that can be cured by irradiation with light even when the composition is applied, for example, as a liquid crystal sealing agent used in a one-drop-fill process, to an adhesion target having a light-shielding part, and a method for sealing a light-shielding part by using the above photocurable resin composition.SOLUTION: The photocurable resin composition comprises a curable compound (component A), a photosensitizer (component B) and a compound (component C) represented by formula (1).SELECTED DRAWING: None
申请公布号 JP2016089084(A) 申请公布日期 2016.05.23
申请号 JP20140226830 申请日期 2014.11.07
申请人 KYORITSU KAGAKU SANGYO KK 发明人 ISHIDA HISAKI;SHIRAHAMA YOSHIHARU
分类号 C08G85/00;C08F2/44;C08F2/50;C08K5/29;C08L101/00;C09K3/10;G02F1/1339 主分类号 C08G85/00
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