| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has an excellent heat radiation property, and that prevents melting when being applied with a large current, and that can operate with stability.SOLUTION: A semiconductor device comprises: a first semiconductor chip; a first electrode arranged on a first surface of the first semiconductor chip; a metal wiring plate electrically connected with the first electrode via a conductive layer; a second electrode arranged on a second surface of the first semiconductor chip and electrically connected with the first semiconductor chip; a first insulating layer that encapsulates the first semiconductor chip and the second electrode; a first opening provided on the first insulating layer, and that exposes the second electrode; a first conductive part provided at the first opening and electrically connected with the second electrode; and a wiring layer arranged on the first insulating layer and electrically connected with the first conductive part. The metal wiring plate has a projection protruded toward the second surface side of the first semiconductor chip. The projection is electrically connected with the wiring layer.SELECTED DRAWING: Figure 1 |
