| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a grinding method preventing generation of asymmetry in removal distribution with a simple method. <P>SOLUTION: This grinding method is to grind a wafer by relatively oscillating with an oscillation mechanism while abutting a grinding surface of a grinding pad rotated and retained at a grinder head on a ground surface of the wafer rotated and retained at a retaining mechanism. This includes a parameter calculating process (step S102) for calculating parameter (asymmetry coefficient κt) to judge whether or not the removal distribution in the ground surface is asymmetry to the rotation center of the ground surface based on the oscillation one-way time of the grinder head in a grinding recipe and wafer one rotation time, and a correction process (step S104) that corrects the grinding recipe by using the parameter calculated by the parameter calculating process. <P>COPYRIGHT: (C)2009,JPO&INPIT |
