| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent the deformation of a solder ball when the solder ball is arranged on a columnar electrode in a semiconductor device such as a CSP. <P>SOLUTION: The upper section of the columnar electrode 9 on a silicon board 1 under a wafer state is coated with flux 25 by a screen printing method, and a solder-ball arranging mask 26 is arranged on the flux 25. A solder-ball arranging device 31 is moved on the solder-ball arranging mask 26. An ascending air current is generated in an internal case 33 fitted in a case 32 by driving a fan 38 in this case, and the solder balls 11 housed in the internal case 33 are collected at the central section of a bottom in the internal case 33. Accordingly, the solder balls 11 are brought into contact mutually but they are only moved so as to be rolled on the solder-ball arranging mask 26 without being brought into contact with the internal case 33 with the movement of the case 32 containing the internal case 33, and the deformation of the solder balls 11 can be prevented. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
