| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless platinum plating bath capable of suppressing film thickness fluctuation, plating at a lower temperature than hitherto, and depositing the whole platinum contained in the plating bath.SOLUTION: An electroless platinum plating bath contains tetraammine platinum(II) hydrogen citrate salt as a platinum source, a buffer agent such as citric acid, a stabilizer such as ammonia, a reducer such as sodium borohydride, and a pH regulator (pH 12-14) such as sodium hydroxide. In the electroless plating bath, tetraammine platinum(II) hydrogen citrate salt suppresses cluster formation, and the particle size in a dynamic light scattering method is 0.7 nm or less.SELECTED DRAWING: Figure 1 |
