Chip resistor, method of producing chip resisitor and chip resistor packaging structure

摘要

[Object];A method for efficiently manufacturing chip resistors is provided.;[Means];The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.

主权项

1. A chip resistor comprising:
a first electrode; a second electrode spaced apart from the first electrode in a first direction; and a resistor portion bonded to the first electrode and the second electrode, wherein the resistor portion extends along a plane spreading in the first direction and a second direction crossing the first direction, and wherein the first electrode includes:
an inner side surface adjacent to the resistor portion;a first side surface spaced apart from the inner side surface in the first direction, the first side surface and the inner side surface being located on opposite sides of the first electrode in the first direction;a second side surface facing in the second direction; anda curved surface directly connected to both the first side surface and the second side surface.