| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate unit realizing miniaturization and thinning and enabling high density mounting. SOLUTION: This substrate unit is constituted of a substrate 1 composed of ceramics or glass epoxy material, and a very small air-core coil 2 and chip components 3 (3a, 3b) which are mounted on the substrate 1. Holes 4 which penetrate the substrate from the surface to the back are formed in proper portions on the substrate 1. The very small air-core coil 2 and chip components 3 are engaged with the holes 4 in the upright state (state that the longitudinal direction becomes perpendicular to the substrate surface).
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