| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable heat-conducting substrate preventing creeping distance from decreasing between a lead frame and a metal plate even if miniaturizing the heat-conducting substrate, and to provide a method for manufacturing the heat-conducting substrate. SOLUTION: Not less than one surface of the heat-conducting substrate comprising a heat transfer layer 11 formed on the metal plate 12 and the lead frame 10 at least partially embedded to the heat transfer layer 11 is set to be only the heat transfer layer 11. In the metal plate 12, not less than one side is hidden inside from the heat transfer layer 11, and the remaining sides project from the heat transfer layer 11. COPYRIGHT: (C)2008,JPO&INPIT |
