发明名称 |
SUBSTRATE FOR HIGH SPEED SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME |
摘要 |
The substrate for a semiconductor package includes a substrate body having a first surface and a second surface opposite to the first surface. Connection pads are formed near an edge of the first surface. Signal lines having conductive vias and first, second, and third line parts are formed. The first line parts are formed on the first surface and are connected to the connection pads and the conductive vias, which pass through the substrate body. The second line parts are formed on the first surface and connect to the conductive vias. The third line parts are formed on the second surface and connect to the conductive vias. The second and third line parts are formed to have substantially the same length. The semiconductor package utilizes the above substrate for processing data at a high speed.
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申请公布号 |
US2009152708(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
US20080049661 |
申请日期 |
2008.03.17 |
申请人 |
LEE WOONG SUN;CHUNG QWAN HO;CHO IL HWAN;LIM SANG JOON;YOO JONG WOO;BAE JIN HO;LEE SEUNG HYUN |
发明人 |
LEE WOONG SUN;CHUNG QWAN HO;CHO IL HWAN;LIM SANG JOON;YOO JONG WOO;BAE JIN HO;LEE SEUNG HYUN |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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