Electrical and mechanical interconnection for electronic components

摘要

The described embodiments relate generally to electronic devices and more particularly to methods for forming mechanical and electrical connections between components within an electronic device. In one embodiment, an interconnect component such as a flex cable is attached to a substrate such as a printed circuit board. A plurality of apertures can be created in the interconnect component, passing through bonding pads located on one end of the interconnect component. The interconnect component can then be aligned with bonding pads on the substrate with the bonding pads on the interconnect component facing away from the substrate. A conductive compound can be injected into the apertures through the interconnect component, forming a mechanical and electrical connection between the bonding pads. In some embodiments, an adhesive layer can be used to further strengthen the bond between the interconnect component and the substrate.

主权项

1. A method for providing an electrical and mechanical connection between a substrate and an interconnect component, the method comprising:
disposing a first conductive bonding pad over a first surface of the interconnect component; forming a first aperture that extends through the first conductive bonding pad; forming a second aperture through the interconnect component, the second aperture aligned with the first aperture and extending from the first surface to a second surface of the interconnect component opposite the first surface, wherein the second surface comprises a planar surface; engaging the second surface with a second conductive bonding pad disposed on the substrate; and depositing a conductive compound into the first aperture and the second aperture, wherein depositing the conductive compound mechanically and electrically couples the first conductive bonding pad to the second conductive bonding pad, and wherein the electrical and mechanical connection between the substrate and the interconnect component is defined by a combined thickness of the interconnect component, the conductive compound, the substrate, the first conductive bonding pad, and the second conductive bonding pad.