| 摘要 |
In a method for the automatic, touch-free and destruction-free analysis of a material bond (4), a dynamic threshold value is varied between a minimum threshold value and a maximum threshold value, wherein regions of heat flow dynamics are determined by means of the material bond (4), which detect values of the heat flow dynamics above the dynamic threshold value. The regions of the heat flow dynamics are analyzed with regard to erratic circumference changes. An erratic circumference change occurs when a limit (7) has been exceeded between a melted zone (5) and a non-melted, but still adhering zone (6) of the material bond (4).
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