METHOD OF ROUGHLY GRINDING SEMICONDUCTOR WAFER, AND APPARATUS OF GRINDING THE SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a method of grinding a semiconductor wafer capable of stabilizing roughness of a surface of the semiconductor wafer by a rough grinding process and efficiently performing a finish-grinding process.

SOLUTION: The method of roughly grinding the semiconductor wafer for roughly grinding the semiconductor wafer W using a grinder 1 includes, in rough grinding before mirror-finish grinding of the wafer W, a first grinding step of grinding the semiconductor wafer W by slurry containing colloidal silica supplied from a slurry supply device 4 and a second grinding step of grinding with pure water supplied from a pure water supply device 5 and an alkaline concentrate solution supplied from an alkaline concentrate solution supply device 6. A pH value of the alkaline solution and grinding time during the second grinding step are specified based on a load current value of a grinding board 2 during the first grinding step.

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