Making a plurality of integrated circuit packages

摘要

A method of making a plurality of integrated circuit packages provides a metal strip. A first leadframe having a first die pad is formed on the metal strip. Also formed are a first plurality of leads with proximal ends adjacent to the first die pad, free distal ends positioned outwardly from the first die pad, and a first leadframe dam bar intersecting the proximal ends of the first plurality of leads. A second leadframe having a second die pad, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second leadframe dam bar intersecting the proximal ends of the second plurality of leads are formed on the metal strip. The free distal ends of said second plurality of leads are aligned with and adjacent to said free distal ends of said first plurality of leads.

主权项

1. A method of making a plurality of integrated circuit packages comprising:
providing a metal strip; on the metal strip, forming a first leadframe having a first die pad having first and second lateral sides, a first plurality of leads with proximal ends adjacent to the first die pad and free distal ends positioned outwardly from the first die pad and a first laterally extending leadframe dam bar intersecting the proximal ends of the first plurality of leads; and on the metal strip, forming a second leadframe having a second die pad having first and second lateral sides, a second plurality of leads with proximal ends adjacent to the second die pad and free distal ends positioned outwardly from the second die pad and a second laterally extending leadframe dam bar intersecting the proximal ends of the second plurality of leads, said free distal ends of said second plurality of leads are positioned being aligned adjacent and non-touching relationship with corresponding said free distal ends of said first plurality of leads.