| 摘要 |
A lead-free solder alloy, comprising from 35 to 59% wt Bi; Cu in a concentration up to 1.0 wt %; from 0.01 to 0.5 wt % Ni; and the balance Sn, together with any unavoidable impurities, with certain embodiments further comprising Ag, such as up to 1 wt % Ag. |
