发明名称 Semiconductor memory device
摘要 <p>Disclosed herein is a semiconductor memory device. In the semiconductor memory device, a transfer transistor (20) having a drain region (12) and a source region (14) is formed on an Si semiconductor substrate (10). A lower end of a storage node (32) is electrically connected to the drain region through a drain contact hole (30) defined in an interlayer insulator (26). The storage node has an on-film extending portion (36) which extends on an upper surface of the interlayer insulator, and a fin-shaped electrode portion (38) which protrudes from the on-film extending portion. Structurally, the fin-shaped electrode portion is provided within a capacitor region (34) so as to extend within a region smaller than the capacitor region and is spaced away from the on-film extending portion on the side of a bit line contact hole (40) defined in the interlayer insulator. &lt;IMAGE&gt;</p>
申请公布号 EP0831531(A1) 申请公布日期 1998.03.25
申请号 EP19970115799 申请日期 1997.09.11
申请人 OKI ELECTRIC INDUSTRY CO., LTD. 发明人 YOSHIDA, MASAHIRO;ANDO, HIDEYUKI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L27/108;H01L21/824 主分类号 H01L27/04
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