| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress a change in reflection factor of a light with time lapse on the side of a substrate, and to improve a reflection factor adjacent to a light emitting element more than heretofore. <P>SOLUTION: The light emitting device includes a sub-mount 3 wherein an LED chip 2 is mounted on a mounting surface, a substrate 4 to which the sub-mount 3 is mounted, and a wire 7 which electrically connects the wiring 4b of the substrate 4 and the electrode 2a of the LED chip 2. The mounting surface of the sub-mount 3 is made of aluminum, and the wiring 4b is not formed immediately under the LED chip 2, but the aluminum is located thereunder. <P>COPYRIGHT: (C)2008,JPO&INPIT |
