3D Semiconductor Package Interposer with Die Cavity

摘要

Disclosed herein is a method of forming a device, comprising mounting a plurality of first interconnects on one or more first integrated circuit dies. One or more second integrated circuit dies are mounted on a first side of an interposer. The interposer is mounted at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer. The interposer is mounted to a first side of a substrate by attaching the first interconnects to the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects.

主权项

1. A device, comprising:
a substrate having a top surface; an interposer over the top surface of the substrate and having a first major surface facing the substrate, the interposer having a first redistribution line (RDL) disposed at the first major surface thereof and a second RDL disposed at a second major surface thereof opposite the first major surface; a first integrated circuit die mounted to the second RDL; a second integrated circuit die mounted to the first RDL; an interconnect extending outside a periphery of the interposer, the interconnect electrically connecting the substrate to the first integrated circuit die; a first connector electrically connecting the interposer and the second integrated circuit die; and a second connector electrically connecting the first RDL and the substrate.