| 发明名称 |
PRINTED CIRCUIT BOARD AND SOLDERING METHOD |
| 摘要 |
A printed circuit board includes: a substrate; a first electrode formed on the substrate; a protrusion member formed on the first electrode and extending from a central portion of the first electrode towards an outer peripheral portion of the first electrode; and a solder covering the first electrode and the protrusion member and connecting the first electrode to a second electrode of a component mounted on the substrate. |
| 申请公布号 |
US2016254241(A1) |
申请公布日期 |
2016.09.01 |
| 申请号 |
US201615007663 |
申请日期 |
2016.01.27 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
MAENO Yoshinobu;MISHIRO Kinuko |
| 分类号 |
H01L23/00;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A printed circuit board comprising:
a substrate; a first electrode formed on the substrate; a protrusion member formed on the first electrode and extending from a central portion of the first electrode towards an outer peripheral portion of the first electrode; and a solder covering the first electrode and the protrusion member and connecting the first electrode to a second electrode of a component mounted on the substrate. |
| 地址 |
Kawasaki-shi JP |
