| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device in which bonding strength between substrates by an adhesive can be improved, and a method for manufacturing an electronic device.SOLUTION: The method for manufacturing an electronic device includes: a first layer deposition step of forming a first photosensitive adhesive 42 on a surface of a first substrate, the surface on a second substrate side; a second layer deposition step of forming a second photosensitive adhesive 43 having a lower curing degree than that of the first photosensitive adhesive 42, overlapping the first photosensitive adhesive 42; and a bonding step of bonding the first substrate with the second substrate by heating the second photosensitive adhesive 43 to cure while the first photosensitive adhesive 42 and the second photosensitive adhesive 43 are interposed between the first substrate and the second substrate.SELECTED DRAWING: Figure 4 |
