| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which reduces expansion of a semiconductor device caused by vaporization of a water content remaining in the interior of the semiconductor device, caused by heat applied upon manufacture of the semiconductor device and upon mounting of the semiconductor device on a mounting substrate. <P>SOLUTION: In the wiring board 10, a through-hole 11b is provided in a semiconductor chip-mounting region 15 to be passed through a wiring substrate 10, and a groove-like pattern 13 is provided in a solder resist in the semiconductor chip-mounting region 15 to communicate with the through-hole 11b. With such an arrangement, the groove-like pattern 13 causes a water content remaining in the semiconductor chip-mounting region 15 to be guided into the through-hole 11b and efficiently discharged from the chip-mounting region 15. For this reason, upon manufacture of a semiconductor device using the wiring board 10 and upon mounting thereof on a mounting substrate, heat applied thereupon can cause no vaporization expansion in the interior of the semiconductor device, thereby enabling reduction of the expansion of the semiconductor device. <P>COPYRIGHT: (C)2010,JPO&INPIT |
