| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit device which is improved in wire bonding stability and wire connection reliability and can be increased in the number of inner leads by providing a package using an insulating film, etc., which fixes front ends of the inner leads to a semiconductor chip by bonding. CONSTITUTION:The title device is provided with a package using an insulating film 4 or insulating substrate which fixes front ends of inner leads 3 to a semiconductor chip 1 by bonding. At the time of manufacturing the semiconductor integrated circuit device provided with, for example, a QFP, the insulating film 4 is used and the semiconductor chip 1 and the zigzag front ends of inner leads 3 are fixed to the film 4 with a bonding agent. Then the zigzag front ends of the inner leads 3 fixed to the film 4 are wire-bonded to the zigzag bonding pads 2 of the chip 1 with wires 5 of Au, etc. Finally, the chip is sealed with the QFP of an epoxy resin. |
