发明名称 A NOVEL BUFFER(SEED) LAYER FOR MAKING A HIGH-PERFORMANCE MAGNETIC TUNNELING JUNCTION MRAM
摘要 <p>PURPOSE: A buffer layer for manufacturing high performance tunneling HRAM is provided to form tunneling barrier layer and integrate MTJ MRAM or TMR reading head for manufacturing high-end magnetic tunneling junction MRAM. CONSTITUTION: A buffer layer for manufacturing high performance tunneling HRAM is as follows. A substrate for shielding NiFe lower shield with upper surface of a plane surface is supplied. The top layer of Ta(85) formed on a substrate. The thickness of Ta top layer is reduced and etched. Te NiCr layer is formed on the Ta phase strata etched. An AFM(AntiFerroMagnetic) pinned layer is formed on the NiCr seed layer.</p>
申请公布号 KR20090119814(A) 申请公布日期 2009.11.20
申请号 KR20090097280 申请日期 2009.10.13
申请人 HEADWAY TECHNOLOGIES, INC.;APPLIED SPINTRONICS, INC. 发明人 HORNG CHENG T.;HONG LIUBO;TONG RU YING;CHEN YU HSIA
分类号 G11B5/39;G11C11/15;G11C11/16;H01F10/30;H01F10/32;H01F41/18;H01F41/30;H01L21/8246;H01L27/105;H01L27/115;H01L43/08;H01L43/10;H01L43/12 主分类号 G11B5/39
代理机构 代理人
主权项
地址