| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic circuit device capable of collectively packaging various electronic components including electronic components such as a plastic lens having a low heat resistance and superior in mass-producibility. <P>SOLUTION: The electronic circuit device comprises a circuit substrate 10 constituted of forming circuit patterns 2 on a resin base 1 by conductive resin paste, surface-mounted electronic components 30, 40 arranged so that electrode terminals are aligned to the connection areas of the circuit patterns 2, connection members 3 consisting of the conductive resin paste to connect each connection area to each electrode terminal, and insulating adhesives 6 formed in spaces between the surface of the circuit substrate 10 and the electronic components 30, 40 and having a curing temperature lower than that of the conductive resin paste to stick the electronic components 30, 40 to the circuit substrate 10. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
