| 摘要 |
A bit of plasma treatment equipment with an etching apparatus and an ashing apparatus and a plasma treatment method using the same are provided to restrain the existence of unwanted materials on an object body. A bit of plasma treatment equipment includes an etching apparatus and an ashing apparatus. The etching apparatus is composed of a first gas supply unit for supplying an etching gas to a process chamber(1), a first vacuum exhaust unit, a first stage for loading an object body(2), a first transfer unit, and a first plasma generating unit for generating a predetermined plasma in the process chamber. The ashing apparatus is composed of a second gas supply unit(4), a second vacuum exhaust unit, a second stage for loading the object body, a second transfer unit, and a second plasma generating unit. The diameter of a second loading portion of the second stage is smaller than that of a first loading portion of the first stage.
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