| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency semiconductor module capable of suppressing mismatching in connection between an electromagnetic coupling part and an external circuit.SOLUTION: A high-frequency semiconductor module according to an embodiment comprises: a cooling body; a high-frequency semiconductor device arranged on the cooling body; and a thermal insulation container that accommodates the cooling body and the high-frequency semiconductor device therein. The high-frequency semiconductor device comprises: a base plate arranged on the cooling body; a signal processing circuit provided on the base plate, and that performs desired signal processing to a high-frequency signal; an electromagnetic coupling part electrically connected with the signal processing circuit, and that electrically connects between the interior and the exterior of the thermal insulation container by electromagnetic coupling; and a height adjustment circuit that has a dielectric body, and a connection wire provided on the dielectric body and that electrically connects between the electromagnetic coupling part and the external circuit arranged outside the thermal insulation container.SELECTED DRAWING: Figure 1 |
