| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition method that enables film deposition on a large area substrate.SOLUTION: Provided is a method of manufacturing an oxide film using a sputtering apparatus which has a target unit 150a and a substrate 160 installed at a substrate holder 170, where a first target 100a and a second target 100b are located with a predetermined space therebetween so that front surfaces thereof face each other, and the substrate holder 170 and a side of the target unit 150a are located with a predetermined space therebetween. The method includes forming plasma including an ion between the first target 100a and the second target 100b by application of a potential therebetween, generating sputtering particles including the oxide, and depositing the sputtering particles on the substrate 160 while the target unit 150a is moved in a direction parallel to a formation surface of the substrate.SELECTED DRAWING: Figure 11 |
