| 摘要 |
PURPOSE:To reduce the manufacturing cost of a semiconductor device by connecting a wiring board to the semiconductor device through contact and whereby providing the wiring board that can be used repeatedly. CONSTITUTION:When a weight 12 is put on a terminal 11a after a semiconductor device 11 is placed on a wiring board 30, a terminal 11a is brought into contact with a contact pin 33a of a contact 33, and is electrically connected to a wiring pattern 32 through a metal spring 11b. When the weight 12 is lifted and is removed, the device 11 can be freely moved from the board 30. Since the board 30 is connected with the device 11 by bringing the contact 33 into contact with them, the board can used repeatedly. |
