发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 <p>A semiconductor device is provided to form a contactless memory array in which a contact hole is not formed in the data line of each memory cell, by using the source/drain of a memory cell transistor as a local data line so that a data line is formed under a wordline. A first charge retention region is formed on a semiconductor substrate(1) of a first conductivity type by interposing a first insulation layer. A second charge retention region is formed on the semiconductor substrate by interposing a second insulation layer. A first gate electrode is formed on the first charge retention region by interposing a first gate insulation layer(4), extended in a first direction. A second gate electrode is formed on the second charge retention region by interposing a second gate insulation layer(5), extended in the first direction. A semiconductor layer(10) is formed on the semiconductor substrate to cross the first and second gate electrodes, extended in a second direction. The semiconductor layer becomes a first impurity region of a first conductivity type. A second impurity region of the second conductivity type can be included in the semiconductor layer, having a lower impurity density than that of the first impurity region. The second impurity region is formed between the semiconductor substrate and the first impurity region.</p>
申请公布号 KR20070075263(A) 申请公布日期 2007.07.18
申请号 KR20060128665 申请日期 2006.12.15
申请人 RENESAS TECHNOLOGY CORP. 发明人 ISHIGAKI TAKASHI;OSABE TARO;KOBAYASHI TAKASHI;IMAI YUTAKA;SHIMIZU MASAHIRO
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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