| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition high in adhesiveness and giving its cured product of high thermal shock resistance, and to provide an adhesive film bearing the adhesive layer made of the composition. <P>SOLUTION: The adhesive composition comprises (A) 100 pts.mass of a phenoxy resin having per molecule at least one alkoxysilane residue of the formula(1)[wherein, R<SP>1</SP>is a 1-4C (substituted) alkyl; and R<SP>2</SP>is a 1-9C (substituted) monovalent group bearing a group selected from amino, cyanate, glycidoxy and thiol groups], (B) 5-200 pts.mass of an epoxy resin, (C) a catalytic amount of an epoxy resin-curing catalyst and (D) 33-300 pts.mass, based on a total of 100 pts.mass of the components(A), (B) and (C), of an inorganic filler. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
