ELECTRONIC MODULE WITH LATERALLY-CONDUCTING HEAT DISTRIBUTOR LAYER

摘要

An electronic module is provided in which a chip is disposed over a substrate and electrically connected to the substrate by a plurality of electrical connect structures disposed between the chip and the substrate. A heat distributor, fabricated of a thermally conductive material, is disposed between the chip and the substrate and sized to extend beyond an edge of the chip to facilitate conduction of heat laterally out from between the chip and substrate. The heat distributor includes openings sized and positioned to allow the electrical connect structures to pass through the heat distributor without electrically contacting the heat distributor. The heat distributor is electrically isolated from the electrical connect structures, the chip and the substrate. In one implementation, the heat distributor physically contacts a thermally conductive enclosure of the electronic module to facilitate conduction of heat from between the chip and substrate to the enclosure.

主权项

1. An electronic module comprising:
a first component disposed over a second component; a plurality of electrical connect structures disposed between and electrically connecting the first component and the second component; and a heat distributor disposed between the first component and the second component, the heat distributor comprising a thermally conductive material and extending laterally beyond an edge of at least the first component to facilitate conduction of heat laterally out from between the first component and the second component past the edge of the first component, the heat distributor comprising a plurality of openings sized and positioned to allow the plurality of electrical connect structures to pass therethrough without electrically contacting the heat distributor, the heat distributor being electrically isolated from the plurality of electrical connect structures.