| 摘要 |
The disclosed invention relates to a lightweight relay enclosure, which enables heat to be emitted by using thermally conductive resin, which enables high heat to be effectively emitted from an enclosure through a predetermined heat sink route, and which enables parts of an RF substrate to be insulated from high heat via an upper cover constituting the enclosure. Provided is the lightweight relay enclosure comprising: a relay case which is made of thermally conductive resin, and on an outside of which heat sinks are formed; an upper cover which is installed on the upper surface of the case; and an RF substrate which is disposed on the bottom surface of the upper cover, wherein a heat sink route (a), which enables high heat of the RF substrate, in surface contact with head portions of thermally conductive pins, to be emitted from a heat sink sheet, is formed by including: through holes which are formed at predetermined locations in a bottom plate of the case; the heat sink sheet which is disposed in a layer form between the heat sinks of the case; and the thermally conductive pins which are connected from the through holes to the heat sink sheet through a bottom portion of the case. |
