| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of rapidly responding to the changeover of a wafer to be processed. SOLUTION: A boat 100 for mounting the wafer is used, having a configuration where a wafer support body 120 is placed by attachment on a wafer boat base 101. The wafer boat base 101 supports the wafer support body 120. The wafer support body 120 includes grooves where the wafer is fitted, erected, and supported. The plurality of wafer support bodies are prepared as the wafer support bodies by each wafer different in kind. When the wafer to be processed is changed-over; the wafer boat base 101 is used as it is, and the wafer support body 120 is exchanged with the wafer support body corresponding to the wafer to be subsequently processed. COPYRIGHT: (C)2008,JPO&INPIT |
