| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor chip tray which prevents semiconductor chips from being damaged during transportation and accommodates any semiconductor chips with different sizes. <P>SOLUTION: The semiconductor chip tray has a tray body 4a and an adhesive sheet 5 for fixing chips. The tray body 4a holds the adhesive sheet 5 in a replaceable form, and further has a protrusion 4b for holding the adhesive sheet 5 and facilitating stacking of the tray body 4a. The tray body 4a is structured to have holes for ultraviolet irradiation and for inserting a thrust-up jig during the chip pick-up operation at the plane portion on the inward side from the protrusion 4b, and the adhesive force of the adhesive sheet 5 can be changed using the ultraviolet irradiation or heating step. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
