| 摘要 |
A sensing insert device (100) is disclosed for measuring a parameter of the muscular-skeletal system. The sensing insert device (100) can be temporary or permanent. The sensing module (200) is a self-contained encapsulated measurement device having at least one contacting surface that couples to the muscular-skeletal system. The sensing module (200) comprises one or more sensing assemblages (2302), electronic circuitry (307), an antenna (2302), and communication circuitry (320). The sensing assemblages (2302) are between a top plate (1502) and a bottom plate (1504) in a sensing platform (121). The bottom plate (1504) is supported by a ledge (1708) on an interior surface of a sidewall (1716) of a housing (1706). A cap (1702) couples to top plate (1502). The sensing assemblage (2302) includes one of a piezo-resistive sensor, MEMS sensor, strain gauge, or mechanical sensor when a force, pressure, or load is applied to the top plate (1502). |
| 主权项 |
1. A sensing module for measuring a load applied by the muscular-skeletal system comprising:
an encapsulating enclosure having a load-bearing surface; a first load sensor coupled to a first portion of the load-bearing surface of the encapsulating enclosure wherein the first load sensor has a planar surface; a second load sensor coupled to a second portion of the load-bearing surface of the encapsulating enclosure; a third load sensor coupled to a third portion of the load bearing surface of the encapsulating enclosure; a first load disk coupled between the encapsulating enclosure and the planar surface of the first load sensor wherein a load applied to the first portion of the load-bearing surface is distributed approximately perpendicular to the planar surface of the first load sensor by the first load disk to prevent inelastic deformation of the first load sensor, and wherein the first load disk is non-compressible; electronic circuitry coupled to the at least three sensors wherein the electronic circuitry and the first, second, and third load sensors are housed in the encapsulating enclosure and wherein the electronic circuitry is configured to control a measurement process, receive measurement data, and transmit the measurement data. |
