发明名称 Data perturbation for wafer inspection or metrology setup using a model of a difference
摘要 Various embodiments for determining parameters for wafer inspection and/or metrology are provided.
申请公布号 US9360863(B2) 申请公布日期 2016.06.07
申请号 US201113258441 申请日期 2011.06.09
申请人 KLA-Tencor Corp. 发明人 Thattaisundaram Govind;Mahadevan Mohan;Gupta Ajay;Chen Chien-Huei Adam;Kulkarni Ashok;Kirkwood Jason;Wu Kenong;Rong Songnian
分类号 G06F17/50;G05B19/418 主分类号 G06F17/50
代理机构 代理人 Mewherter Ann Marie
主权项 1. A computer-implemented method for determining one or more parameters for wafer processing, comprising: generating a model of a difference between performance of one or more first wafer scans and performance of one or more second wafer scans; generating results for a wafer using the one or more first wafer scans; generating perturbed results for the wafer using the results and the model, wherein the perturbed results simulate results that would be generated for the wafer by the one or more second wafer scans; and determining one or more parameters for the wafer processing based on the perturbed results, wherein the wafer processing comprises performing the one or more second wafer scans, and wherein steps of the method are performed by a computer system; and wherein the method is performed at predetermined intervals, and wherein the wafer processing is performed using the one or more parameters determined after the most recent interval if the results or the perturbed results generated after the last two intervals is different from each other by more than a predetermined value.
地址 Milpitas CA US