发明名称 環状凸部除去装置
摘要 PROBLEM TO BE SOLVED: To provide an annular protrusion removal device in which the risk of damaging an annular protrusion can be reduced when removing the annular protrusion.SOLUTION: The annular protrusion removal device for removing an annular protrusion 25 from a wafer unit 59 formed from a wafer 11 in which a parting groove is formed in a boundary portion between a circular recess and an annular protrusion 25, an adhesive tape 58 and an annular frame 56 comprises: hold means for holding the wafer unit 59; and annular protrusion removal means which includes a plurality of claws 46 capable of simultaneously moving between a standby position and active positions mutually close in a radial direction, and perpendicular move means for moving the plurality of claws 46 in a perpendicular direction, and removes the annular protrusion 25 from the wafer unit 59. The plurality of claws 46 include: an air emission port 49 for forming an exfoliation origin by emitting air to an interface between the annular protrusion 25 of the wafer 11 formed in a distal end and the adhesive tape 58; and an air supply path 47 of which one end is communicated to the air emission port 49 and the other end is connected to an air supply source 51.
申请公布号 JP6037738(B2) 申请公布日期 2016.12.07
申请号 JP20120200783 申请日期 2012.09.12
申请人 株式会社ディスコ 发明人 山岸 桂子
分类号 H01L21/304 主分类号 H01L21/304
代理机构 代理人
主权项
地址
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