| 摘要 |
PROBLEM TO BE SOLVED: To maintain adhesion of a wiring conductor layer and a resin insulation layer, while improving the quality of connection with other board, or the like.SOLUTION: In a printed wiring board, a wiring conductor layer is embedded so as to expose the first surface F1 of the wiring conductor layer, and a resin insulation layer 30 is formed to cover the side face of a conductor post 25, and to expose the end face 25a of the conductor post 25. The resin insulation layer 30 contains 70-95 wt% of inorganic filler 31, having a maximum grain size P smaller than 1/3 of the height H1 of the conductor post 25.SELECTED DRAWING: Figure 1B |
