发明名称 |
ADHESIVE JOINT SYSTEM FOR PRINTED CIRCUIT BOARDS |
摘要 |
An adhesive joint system comprises a circuit board with a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing. An adhesive is positioned at least in the gap surrounding the tongue, and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side. The respective coefficients of thermal expansion (CTE) of the tongue, adhesive, and the material defining the groove are related, such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap. |
申请公布号 |
US2016381790(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201514754413 |
申请日期 |
2015.06.29 |
申请人 |
Markovsky Igor;Nikkhoo Michael;Pletenetskyy Andriy;Hurbi Erin |
发明人 |
Markovsky Igor;Nikkhoo Michael;Pletenetskyy Andriy;Hurbi Erin |
分类号 |
H05K1/02;G06T19/00;H05K3/46;G06F3/01;H05K3/00;H05K3/30;H05K5/00;G02B27/01 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
|
主权项 |
1. An adhesive joint system, comprising:
a circuit board including a distal end and a proximal end mounted on a first side via a tongue and groove connection to a housing, the tongue and groove connection including a tongue and a groove and a gap between the tongue and the groove; an adhesive positioned at least in the gap surrounding the tongue; and an electrical component mounted to the distal end on a second side of the circuit board that is opposite the first side; wherein respective coefficients of thermal expansion of the tongue, adhesive, and material defining the groove are related such that as heat is applied to the tongue and groove connection, the adhesive is compressed within the gap. |
地址 |
Redwood City CA US |