METHOD FOR FORMING CONDUCTIVE BUMP

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a conductive bump efficiently with high precision at a low cost. SOLUTION: The method for forming a conductive bump comprises steps of: (1) filling a recess in a mold material 2 having the recess 1 for bump formation with conductive paste 6a; (2) superimposing a substrate 7 on the filler in the recess and hardening the conductive paste in the superimposed state; and (3) transferring the filler in the recess onto the substrate 7. COPYRIGHT: (C)2008,JPO&INPIT