Apparatus and methods for stackable packaging

摘要

A semiconductor structure includes a lead frame having a flag and a plurality of leads, a semiconductor die attached to a first major surface of the flag, and a plurality of re-routed lead fingers attached to the lead frame. The plurality of leads has a first pitch. The first end of each re-routed lead finger is attached to a lead of the plurality of leads. Each re-routed lead finger extends over the semiconductor die such that a second end of each re-routed lead finger is over and spaced apart from the flag of the lead frame. The second ends of the plurality of re-routed lead fingers has a second pitch different from the first pitch.

主权项

1. A semiconductor structure comprising:
a lead frame having a flag and a plurality of leads, the plurality of leads having a first pitch; a semiconductor die attached to a first major surface of the flag; and a plurality of re-routed lead fingers attached to the lead frame, wherein: a first end of each re-routed lead finger of the plurality of re-routed lead fingers is attached to a lead of the plurality of leads, each re-routed lead finger extends over the semiconductor die such that a second end of each re-routed lead finger is over and spaced apart from the flag of the lead frame, and the second ends of the plurality of re-routed lead fingers has a second pitch different from the first pitch; a mold compound around the semiconductor die and between the second ends of the plurality of re-routed lead fingers and a top surface of the semiconductor die; and a plurality of wirebond connections between the top surface of the semiconductor die and the plurality of leads of the lead frame, wherein the plurality of re-routed lead fingers extend over the plurality of wirebond connections.