发明名称 LED mixing chamber with reflective walls formed in slots
摘要 A relatively large substrate has a reflective surface, such as a diffusive white surface. LED dies, either as bare LED dies or packaged LED dies, are mounted to the substrate to form separate arrays of LEDs. Each array is intended for a separate mixing chamber. A layer of an encapsulant, such as silicone, is deposited over the substrate to encapsulate the LED dies. A laser etches through the encapsulant to form slots, and a reflective material, such as a white paint, is deposited in the slots to form reflective walls of each mixing chamber. If desired, a phosphor layer is deposited over the encapsulant and reflective walls. The substrate is then singulated to separate out the mixing chambers. Since no discrete parts are assembled, and multiple mixing chambers are formed simultaneously, the resulting mixing chambers are inexpensive and very reliable.
申请公布号 US9391246(B2) 申请公布日期 2016.07.12
申请号 US201614996192 申请日期 2016.01.14
申请人 KONINKLIJKE PHILIPS N.V. 发明人 de Samber Marc Andre
分类号 H01L33/60;H01L33/50;H01L25/075;H01L33/52;H01L33/06;H01L33/32;H01L33/56 主分类号 H01L33/60
代理机构 Patent Law Group LLP 代理人 Patent Law Group LLP ;Ogonowsky Brian D.
主权项 1. A device comprising: a substrate, the substrate having a first surface; a plurality of LED dies mounted on the first surface of the substrate; a metal ring formed over the substrate and surrounding the plurality of LED dies, the metal ring providing a etch stop; a mixing chamber comprising: a light-transmissive covering layer over the substrate, metal ring, and LED dies;a slot etched in the covering layer surrounding the LED dies, the slot being formed overlying the metal ring while using the metal ring as an etch stop;a reflective material at least partially filling the slot to form a reflective wall around the LED dies, the reflective wall having a height above the substrate that is greater than a height of a top surface of the LED dies above the substrate, the reflective wall having an inside surface facing the plurality of LED dies and having an outside surface; anda portion of the covering layer being present around the outside surface of the reflective material after singulation of the substrate to form individual devices.
地址 Eindhoven NL