| 发明名称 |
Electronic Devices Comprising Two Encapsulant Films |
| 摘要 |
An electronic device comprises a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet. The first encapsulating film has a zero shear viscosity greater than that of the second encapsulating film. The back sheet of the electronic device contains fewer bumps than the back sheet of a comparable electronic device having a first encapsulating film with a zero shear viscosity less than or equal to that of the second encapsulating film. |
| 申请公布号 |
US2016276512(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201414777693 |
申请日期 |
2014.04.16 |
| 申请人 |
DOW GLOBAL TECHNOLOGIES LLC |
发明人 |
Nanjundiah Kumar;Naumovitz John A.;White Michael D. |
| 分类号 |
H01L31/048;H01L31/18;H01L31/049 |
主分类号 |
H01L31/048 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic device comprising a first encapsulating film in direct contact with a light-receiving and transmitting film and a second encapsulating film in direct contact with a back sheet, the first encapsulating film having a zero shear viscosity greater than that of the second encapsulating film. |
| 地址 |
Midland MI US |
