发明名称 ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND DISPLAY DEVICE
摘要 An array substrate, a method for fabricating the same, and a display device are provided. A metal shielding layer is electrically connected with a common electrode. A first connection part used for electrically connecting the metal shielding layer and the common electrode is arranged in the same layer as a source/drain electrode, and is electrically connected with the metal shielding electrode by means of a via penetrating the first insulating layer and the buffer layer. A storage capacitor is formed between an active layer and the metal shielding layer, increasing capacitance of the array substrate. The first connection part and the source/drain electrode which are arranged in the same layer can be formed by performing a patterning process once, thus reducing the fabricating flow, simplifying the fabricating process, saving the fabricating cost, and decreasing the fabricating time.
申请公布号 US2016276376(A1) 申请公布日期 2016.09.22
申请号 US201414646046 申请日期 2014.08.25
申请人 BOE TECHNOLOGY GROUP CO., LTD. ;ORDOS YUANSHENG OPTOELECTRONICS CO., LTD. 发明人 Sun Jian;Chen Pengjun;Li Cheng;An Seongjun
分类号 H01L27/12 主分类号 H01L27/12
代理机构 代理人
主权项 1. An array substrate, comprising a substrate, and a metal shielding layer, a buffer layer, a top-gate thin film transistor, and a common electrode which are arranged on the substrate successively; wherein in the top-gate thin film transistor, a source/drain electrode is arranged over an active layer and is electrically connected with the active layer by means of a first via penetrating a first insulating layer between the source/drain electrode and the active layer, wherein the array substrate further comprises: a first connection part which is arranged in the same layer as the source/drain electrode, is used for electrically connecting the metal shielding layer and the common electrode, and is electrically connected with the metal shielding layer by means of a second via penetrating the first insulating layer and the buffer layer.
地址 Beijing CN