| 发明名称 |
WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE |
| 摘要 |
A wiring substrate includes a connection pad formed in the outermost wiring layer, a dummy pad formed in the outermost wiring layer, and a dummy wiring portion formed in the outermost wiring layer, the dummy wiring portion connecting the connection pad and the dummy pad. The maximum width of each of the connection pad and the dummy pad is set to be larger than the width of the dummy wiring portion. A bump of an electronic component is flip-chip connected to a connection pad through a resin-containing solder. |
| 申请公布号 |
US2016276301(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
US201615012017 |
申请日期 |
2016.02.01 |
| 申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA Kei |
| 分类号 |
H01L23/00;H01L23/31;H01L23/498 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring substrate, comprising:
a connection pad formed in an outermost wiring layer; a dummy pad formed in the outermost wiring layer; and a dummy wiring portion formed in the outermost wiring layer, the dummy wiring portion connecting the connection pad and the dummy pad, wherein, a maximum width of each of the connection pad and the dummy pad is larger than a width of the dummy wiring portion. |
| 地址 |
Nagano-shi JP |
