| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a silicon coupling agent showing high bonding properties with a base material in resin molding at ≥200°C, a resin composition containing the silicon coupling agent and having excellent stability, and to provide a resin molding method for integrating the resin composition and the base material together. <P>SOLUTION: A photosensitive resin composition comprises (i) one or more resins selected from the group consisting of a polyimide precursor resin, a polybenzoxazole precursor resin, a polyamide resin, and a phenol resin, (ii) a silicon coupling agent represented by general formula (1) and obtained by reacting an isocyanate compound or a carbonate derivative with a silicon compound having an amino group or reacting a silicon compound having an isocyanate group with monoamine and/or monovalent alcohol, and (iii) a sensitizer. In the formula, R<SB>1</SB>, R<SB>2</SB>are each independently a 1C-4C alkyl group; R<SB>3</SB>is a divalent organic group; R<SB>4</SB>is a group selected from-NH-R<SB>5</SB>or -O-R<SB>6</SB>, (each of R<SB>5</SB>and R<SB>6</SB>is a monovalent organic group not including a COOH group); and n is an integer of 1-3. <P>COPYRIGHT: (C)2010,JPO&INPIT |
