| 摘要 |
A flip-chip and underfilled device, which includes a semiconductor chip ( 101 ) with contact pads and a workpiece ( 102 ) with contact pads in matching locations; the workpiece may be an insulating substrate or another semiconductor chip. The workpiece and the chip are spaced by a gap ( 103 ) of substantially uniform average width. Attached to each chip contact pad is a column-shaped spacer ( 140 ), which includes two or more deformed spheres of non-reflow metals, preferably gold, bonded together to a height about equal to the gap width. The spacer is attached to the contact pad ( 110 ) substantially normal to the chip surface and extends from the chip pad to the matching workpiece pad ( 120 ); it is bonded to the workpiece pad by reflow metals ( 141 ) such as tin or tin alloy, which covers at least portions of the workpiece pad and the spacer. The gap may be filled with a polymer material ( 105 ) surrounding the reflow metal and spacers.
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