| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for sufficiently securing an adhesion area between a substrate and a radiator plate, and also eliminating trouble to be caused by the leakage of a surplus adhesive material. <P>SOLUTION: The semiconductor device includes: a coreless substrate 2; a semiconductor chip 3 is flip-chip mounted onto the coreless substrate 2; and a lid 5 to be joined with the semiconductor chip 3 via a TIM material 17 and to be joined with a sealing resin layer 4 via a seal band material 18. A plurality of dimples 16a are formed on the jointing surface of the lid 5 with the sealing resin layer 4. <P>COPYRIGHT: (C)2010,JPO&INPIT |
