| 摘要 |
Provided is a coreless board manufacturing method. The method comprises: providing a supporting carrier; laminating inner copper foil layers on an upper accumulation layer of the supporting carrier, disposing inner prepregs between the inner copper foil layers, and disposing outer copper foil layers outside outer prepregs to manufacture a coreless board, the highest temperature for laminating the inner copper foil layers and the inner prepregs ranging from 140ºC to 180ºC; and separating the coreless board from the supporting carrier. In the coreless board manufacturing method, in a laminating process, pre-lamination is used for the inner prepregs and the inner copper foil layers, full-lamination is used for outer layers, the laminating temperature and the laminating time are both improved, the residual stress on the inner prepregs is lowered, and the buckling of the coreless board is reduced. |
